Wafer Edge Profile Measurement Device
Conventional high-speed measurement capability about 10 times faster! It is possible to capture the shape of the edge in just a few seconds!
The wafer edge profile measurement device EPM-300 is equipped with a uniquely developed laser microscope that measures edge shapes with sub-micron accuracy. When combined with processes like CMP, it allows for the overlay and verification of edge shapes before and after polishing. It features a high-speed measurement function that captures profiles at approximately ten times the speed of conventional methods, enabling edge shape acquisition in just a few seconds. Additionally, it includes functions for roundness measurement, notch alignment, notch shape measurement, and image acquisition, with an option for measuring the cross-sectional shape of notches. Furthermore, in addition to 200mm and 300mm wafers, edge shape measurement for 450mm wafers is also available as an option, allowing for rapid verification of upcoming sample products.
- 企業：大倉インダストリー
- 価格：Other
